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dc.contributor.authorZarmai, Musa T
dc.contributor.authorOduoza, Chike F
dc.date.accessioned2020-11-24T12:03:56Z
dc.date.available2020-11-24T12:03:56Z
dc.date.issued2020-11-13
dc.identifier.citationZarmai, M.T. and Oduoza, C.F. (2020) Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly, Microelectronics Reliability, 116, 114008.en
dc.identifier.issn0026-2714en
dc.identifier.doi10.1016/j.microrel.2020.114008en
dc.identifier.urihttp://hdl.handle.net/2436/623787
dc.descriptionThis is an accepted manuscript of an article published by Elsevier in Microelectronics Reliability on 13/11/2020, available online: https://doi.org/10.1016/j.microrel.2020.114008 The accepted version of the publication may differ from the final published version.en
dc.description.abstractThis study evaluates the impact of intermetallic compound (IMC) thickness on thermo-mechanical reliability of lead-free SnAgCu solder joints in crystalline silicon solar cell assembly with regard to fatigue life. Finite element modelling is used to simulate the non-linear thermo-mechanical deformation of the joints. Five geometric models of solar cell assemblies with different IMC thickness layers in the range of 1 to 4 μm are utilized. The models were subjected to accelerated thermal cycling from 40 °C to 85 °C employing IEC 61215 standard for photovoltaic panels. Creep response of each of the assembly's solder joints to the induced thermal load were simulated using Garofalo-Arrhenius creep model. Simulation results indicate that when IMC thickness grows incrementally to 1, 2, 2.5, 3 and 4 μm, thermo-mechanical fatigue life of solder joints diminishes to 13,800, 11,800, 10,600, 9400 and 7800 cycles to failure respectively. Thus, solder joint fatigue life decreases as the IMC thickness increases during service lifetime. Therefore, proper design of solder joint in crystalline silicon solar cell assembly must include consideration of IMC layer thickness to prevent premature failure and to ensure fulfilment of desired functional lifetime of 13,688 cycles to failure (25 years).en
dc.formatapplication/pdfen
dc.languageen
dc.language.isoenen
dc.publisherElsevieren
dc.relation.urlhttps://www.sciencedirect.com/science/article/pii/S0026271420308957?via%3Dihuben
dc.subjectfinite element modellingen
dc.subjectsolar cell assemblyen
dc.subjectsolder jointen
dc.subjectintermetallic compound thicknessen
dc.subjectthermo-mechanical reliabilityen
dc.subjectWeibull analysisen
dc.titleImpact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assemblyen
dc.typeJournal articleen
dc.identifier.journalMicroelectronics Reliabilityen
dc.date.updated2020-11-16T21:55:55Z
dc.date.accepted2020-11-04
rioxxterms.funderUniversity of Wolverhamptonen
rioxxterms.identifier.projectUOW24112020COen
rioxxterms.versionAMen
rioxxterms.licenseref.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/en
rioxxterms.licenseref.startdate2021-11-13en
dc.source.volume116
dc.source.beginpage114008
dc.source.endpage114008
dc.description.versionAccepted version
refterms.dateFCD2020-11-24T12:00:17Z
refterms.versionFCDAM


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