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dc.contributor.authorGhaleeh, Mohammad
dc.contributor.authorBaroutaji, Ahmad
dc.contributor.authorAl Qubeissi, Mansour
dc.date.accessioned2020-09-03T09:19:29Z
dc.date.available2020-09-03T09:19:29Z
dc.date.issued2020-08-11
dc.identifier.citationGhaleeh, M., Baroutaji, A. and Al Qubeissi, M. (2020) Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints, Engineering Failure Analysis, 117 (November 2020), 104846.en
dc.identifier.issn1350-6307en
dc.identifier.doi10.1016/j.engfailanal.2020.104846en
dc.identifier.urihttp://hdl.handle.net/2436/623574
dc.descriptionThis is an accepted manuscript of an article published by Elsevier in Engineering Failure Analysis on 11/08/2020, available online: https://doi.org/10.1016/j.engfailanal.2020.104846 The accepted version of the publication may differ from the final published version.en
dc.description.abstractThe reliability of solder joints is a critical issue in the microelectronics industry. The requirement of permanent electrical and thermal connections between solder alloys and the various components of a surface mount device is dependent upon the mechanical integrity of the solder and its interfaces. Accordingly, in this paper, the reliability of lead-free, Sn-3.8Ag-0.7Cu, and leaded, Sn-37Pb, solder alloys was investigated under both thermal-mechanical fatigue (TMF) and isothermal mechanical fatigue (IF) conditions. The investigation included material characterisation and fatigue testing on 4-ball grid array (BGA) specimens. The IF tests were carried out under load control at three different temperatures including Room Temperature (RT), 35 °C and 75 °C. Also, a set of ‘not-in-phase’ (nIP), ‘in-phase’ (IP) and ‘out-of-phase’ (OoP) combined thermal and mechanical cycling tests were carried out to investigate the TMF behaviour of the solders. The stress-life curves for each test condition were generated and then compared taking into account the observations on microstructure. It was found that the IF and TMF performance of Sn-3.8Ag-0.7Cu alloy was better than Sn-37Pb alloy when expressed as stress-life curves. Additionally, the Sn-3.8Ag-0.7Cu was less susceptible to the changes in temperature. This study provides a comprehensive insight into the reliability of solder alloys under a wide range of loading conditions.en
dc.formatapplication/pdfen
dc.languageen
dc.language.isoenen
dc.publisherElsevieren
dc.relation.urlhttps://www.sciencedirect.com/science/article/abs/pii/S1350630720310566?via%3Dihuben
dc.subjectsolder jointsen
dc.subjectlead-freeen
dc.subjectshear stressen
dc.subjectball grid arrayen
dc.subjectthermo-mechanical fatigueen
dc.subjectisothermal fatigueen
dc.titleMicrostructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder jointsen
dc.typeJournal articleen
dc.identifier.journalEngineering Failure Analysisen
dc.date.updated2020-08-19T14:44:28Z
dc.date.accepted2020-08-10
rioxxterms.funderUniversity of Wolverhamptonen
rioxxterms.identifier.projectUOW03092020ABen
rioxxterms.versionAMen
rioxxterms.licenseref.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/en
rioxxterms.licenseref.startdate2021-08-11en
dc.source.volume117
dc.source.beginpage104846
dc.source.endpage104846
dc.description.versionAccepted version
refterms.dateFCD2020-09-03T09:07:43Z
refterms.versionFCDAM


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