Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints
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Abstract
The reliability of solder joints is a critical issue in the microelectronics industry. The requirement of permanent electrical and thermal connections between solder alloys and the various components of a surface mount device is dependent upon the mechanical integrity of the solder and its interfaces. Accordingly, in this paper, the reliability of lead-free, Sn-3.8Ag-0.7Cu, and leaded, Sn-37Pb, solder alloys was investigated under both thermal-mechanical fatigue (TMF) and isothermal mechanical fatigue (IF) conditions. The investigation included material characterisation and fatigue testing on 4-ball grid array (BGA) specimens. The IF tests were carried out under load control at three different temperatures including Room Temperature (RT), 35 °C and 75 °C. Also, a set of ‘not-in-phase’ (nIP), ‘in-phase’ (IP) and ‘out-of-phase’ (OoP) combined thermal and mechanical cycling tests were carried out to investigate the TMF behaviour of the solders. The stress-life curves for each test condition were generated and then compared taking into account the observations on microstructure. It was found that the IF and TMF performance of Sn-3.8Ag-0.7Cu alloy was better than Sn-37Pb alloy when expressed as stress-life curves. Additionally, the Sn-3.8Ag-0.7Cu was less susceptible to the changes in temperature. This study provides a comprehensive insight into the reliability of solder alloys under a wide range of loading conditions.Citation
Ghaleeh, M., Baroutaji, A. and Al Qubeissi, M. (2020) Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints, Engineering Failure Analysis, 117 (November 2020), 104846.Publisher
ElsevierJournal
Engineering Failure AnalysisType
Journal articleLanguage
enDescription
This is an accepted manuscript of an article published by Elsevier in Engineering Failure Analysis on 11/08/2020, available online: https://doi.org/10.1016/j.engfailanal.2020.104846 The accepted version of the publication may differ from the final published version.ISSN
1350-6307ae974a485f413a2113503eed53cd6c53
10.1016/j.engfailanal.2020.104846
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Except where otherwise noted, this item's license is described as https://creativecommons.org/licenses/by-nc-nd/4.0/