Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies

2.50
Hdl Handle:
http://hdl.handle.net/2436/620932
Title:
Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies
Authors:
Amalu, Emeka H. ( 0000-0001-6800-847X ) ; Ekere, N.N.
Citation:
Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies 2016, 39:9 Journal of Manufacturing Systems
Publisher:
Elsevier
Journal:
Journal of Manufacturing Systems
Issue Date:
Apr-2016
DOI:
10.1016/j.jmsy.2016.01.002
Additional Links:
http://linkinghub.elsevier.com/retrieve/pii/S0278612516000030
Type:
Article
Language:
en
ISSN:
02786125
Appears in Collections:
FSE

Full metadata record

DC FieldValue Language
dc.contributor.authorAmalu, Emeka H.en
dc.contributor.authorEkere, N.N.en
dc.date.accessioned2017-11-30T10:14:49Z-
dc.date.available2017-11-30T10:14:49Z-
dc.date.issued2016-04-
dc.identifier.citationModelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies 2016, 39:9 Journal of Manufacturing Systemsen
dc.identifier.issn02786125-
dc.identifier.doi10.1016/j.jmsy.2016.01.002-
dc.language.isoenen
dc.publisherElsevieren
dc.relation.urlhttp://linkinghub.elsevier.com/retrieve/pii/S0278612516000030en
dc.rightsArchived with thanks to Journal of Manufacturing Systemsen
dc.subjectCreep constitutive relationsen
dc.subjectFatigue damageen
dc.subjectConstitutive behaviouren
dc.subjectRate-dependent materialen
dc.subjectTemperature cycling loadingen
dc.subjectLead-free solder alloyen
dc.subjectSolder joint reliabilityen
dc.subjectFinite element modellingen
dc.titleModelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assembliesen
dc.typeArticleen
dc.identifier.journalJournal of Manufacturing Systemsen
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