Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

2.50
Hdl Handle:
http://hdl.handle.net/2436/620535
Title:
Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections
Authors:
Zarmai, Musa T.; Ekere, N.N.; Oduoza, C.F.; Amalu, Emeka H.
Abstract:
The soldering process of interconnecting crystalline silicon solar cells to form photovoltaic (PV) module is a key manufacturing process. However, during the soldering process, stress is induced in the solar cell solder joints and remains in the joint as residual stress after soldering. Furthermore, during the module service life time, thermo-mechanical degradation of the solder joints occurs due to thermal cycling of the joints which induce stress, creep strain and strain energy. The resultant effect of damage on the solder joint is premature failure, hence shortened fatigue life. This study seeks to determine accumulated thermo-mechanical damage and fatigue life of solder interconnection in solar cell assembly under thermo-mechanical cycling conditions. In this investigation, finite element modelling (FEM) and simulations are carried out in order to determine nonlinear degradation of SnAgCu solder joints. The degradation of the solder material is simulated using Garofalo-Arrhenius creep model. A three dimensional (3D) geometric model is subjected to six accelerated thermal cycles (ATCs) utilising IEC 61215 standard for photovoltaic panels. The results demonstrate that induced stress, strain and strain energy impacts the solder joints during operations. Furthermore, the larger the accumulated creep strain and creep strain energy in the joints, the shorter the fatigue life. This indicates that creep strain and creep strain energy in the solder joints significantly impacts the thermo-mechanical reliability of the assembly joints. Regions of solder joint with critical stress, strain and strain energy values including their distribution are determined. Analysis of results demonstrates that creep energy density is a better parameter than creep strain in predicting interconnection fatigue life. The use of six ATCs yields significant data which enable better understanding of the response of the solder joints to the induced loads. Moreover, information obtained from this study can be used for improved design and better-quality fabrication of solder interconnections in solar cell assembly for enhanced thermo-mechanical reliability.
Citation:
Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections 2017, 47:37 Robotics and Computer-Integrated Manufacturing
Publisher:
Elsevier
Journal:
Robotics and Computer-Integrated Manufacturing
Issue Date:
Oct-2017
URI:
http://hdl.handle.net/2436/620535
DOI:
10.1016/j.rcim.2016.12.008
Additional Links:
http://linkinghub.elsevier.com/retrieve/pii/S0736584515301435
Type:
Article
Language:
en
ISSN:
0736-5845,
Appears in Collections:
FSE

Full metadata record

DC FieldValue Language
dc.contributor.authorZarmai, Musa T.en
dc.contributor.authorEkere, N.N.en
dc.contributor.authorOduoza, C.F.en
dc.contributor.authorAmalu, Emeka H.en
dc.date.accessioned2017-06-27T07:55:04Z-
dc.date.available2017-06-27T07:55:04Z-
dc.date.issued2017-10-
dc.identifier.citationEvaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections 2017, 47:37 Robotics and Computer-Integrated Manufacturingen
dc.identifier.issn0736-5845,en
dc.identifier.doi10.1016/j.rcim.2016.12.008-
dc.identifier.urihttp://hdl.handle.net/2436/620535-
dc.description.abstractThe soldering process of interconnecting crystalline silicon solar cells to form photovoltaic (PV) module is a key manufacturing process. However, during the soldering process, stress is induced in the solar cell solder joints and remains in the joint as residual stress after soldering. Furthermore, during the module service life time, thermo-mechanical degradation of the solder joints occurs due to thermal cycling of the joints which induce stress, creep strain and strain energy. The resultant effect of damage on the solder joint is premature failure, hence shortened fatigue life. This study seeks to determine accumulated thermo-mechanical damage and fatigue life of solder interconnection in solar cell assembly under thermo-mechanical cycling conditions. In this investigation, finite element modelling (FEM) and simulations are carried out in order to determine nonlinear degradation of SnAgCu solder joints. The degradation of the solder material is simulated using Garofalo-Arrhenius creep model. A three dimensional (3D) geometric model is subjected to six accelerated thermal cycles (ATCs) utilising IEC 61215 standard for photovoltaic panels. The results demonstrate that induced stress, strain and strain energy impacts the solder joints during operations. Furthermore, the larger the accumulated creep strain and creep strain energy in the joints, the shorter the fatigue life. This indicates that creep strain and creep strain energy in the solder joints significantly impacts the thermo-mechanical reliability of the assembly joints. Regions of solder joint with critical stress, strain and strain energy values including their distribution are determined. Analysis of results demonstrates that creep energy density is a better parameter than creep strain in predicting interconnection fatigue life. The use of six ATCs yields significant data which enable better understanding of the response of the solder joints to the induced loads. Moreover, information obtained from this study can be used for improved design and better-quality fabrication of solder interconnections in solar cell assembly for enhanced thermo-mechanical reliability.en
dc.language.isoenen
dc.publisherElsevieren
dc.relation.urlhttp://linkinghub.elsevier.com/retrieve/pii/S0736584515301435en
dc.rightsArchived with thanks to Robotics and Computer-Integrated Manufacturingen
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectPV manufacturingen
dc.subjectCrystalline silicon solar cellen
dc.subjectSolder jointen
dc.subjectThermo-mechanical damageen
dc.subjectFatigue lifeen
dc.titleEvaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnectionsen
dc.typeArticleen
dc.identifier.journalRobotics and Computer-Integrated Manufacturingen
dc.date.accepted2016-12-
rioxxterms.funderInternalen
rioxxterms.identifier.projectUoW270617COen
rioxxterms.versionAMen
rioxxterms.licenseref.urihttps://creativecommons.org/CC BY-NC-ND 4.0en
rioxxterms.licenseref.startdate2018-10-01en
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